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| www..com Product Guide 1111C Series Ultra Compact SMT LED s Features * Meets industry standards for 1608 (0603) footprint * Provides bright, wide and uniform spatial distribution * Excellent for cellular telephone key pads, * LCD backlighting and pager display application. s Applications * Mobile devices (cellular telephones, PDAs, pagers) * Industrial / Medical instrumentation s Outline Dimensions Epoxy PCB PCB Warpage direction Unit: mm Tolerances + 0.1 s Electro-Optical Characteristics Type No. Material Emitted Color GaAIAs GaAsP GaAsP GaP GaP GaP Red Orange Yellow Yellow Green Green Pure Green (Ta=25C) Wavelength IF Peak p TYP. Spectral Line Dominant Half Width d TYP. TYP. IF Lens Color Luminous Intensity IV MIN. TYP. Forward Voltage VF TYP MAX. IF Reverse Viewing Current IR Angle MAX. VR (2 1/2) BR1111C AA1111C AY1111C PY1111C PG1111C BG1111C 7.0 2.0 Milky White 11.7 20 660 3.4 3.4 6.4 2.4 20 605 20 580 20 560 20 555 mA 647 606 590 572 567 558 nm 30 30 30 30 30 30 20 20 20 20 20 20 mA 1.7 2.3 2.2 2.8 2.2 2.8 2.1 2.8 2.1 2.8 2.1 2.8 V 20 20 20 20 20 20 mA 100 100 100 100 100 100 A 4 4 4 4 4 4 V 140 2.0 7.0 3.8 1.4 11.7 20 570 150 Units mcd Deg. www..com s Absolute Maximum Ratings Red Orange AA 70 25 60 4 Yellow AY 70 25 60 4 -30 to +85 -40 to +100 0.36 (DC) 0.86 (Pulse) (Ta=25C) Yellow Green PY 70 25 60 4 Green PG 70 25 60 4 Pure Green PY 70 25 60 4 mW mA mA V C C mA/C Item Symbol Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Derating* Pd IF IFM VR Topr Tstg IF BR 57.5 25 60 4 Units * Ta=25C, IFM applies for the pulse width 1msec. and duty cycle 1/20. s Taping Specifications 1.5 +0.1 0 1.75+0.1 s Operation Current Derating Chart (DC) 4+0.1 (1) (0.2) Center Hole 8+0.2 Quantity on tape: 4000 pieces per reel ( 0.5) Center Hole 2+0.05 4+0.1 3.5+0.05 (1.85) (0.9) 2+0.5 21+0.8 Direction to pull BR, AA, AY, PY, PG, BG +1 60 -0 13+0.2 13+0.2 9+0.3 11.4+1 +0 180 3 s Precautions Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: * Soldering iron: Temperature at tip of iron: 280C max. (30W max.) Soldering time: 3 sec. max. * Dip soldering: Preheating: 120 ~ 150C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260C max. Dipping Time: 5 sec. max. * Reflow Soldering: LED Surface Temperature C Operation Heating 240 Temperature rise: 5C/sec. Cooling: --5C/sec. s Spatial Distribution 150 120 Pre-heating 2. Cleaning: * If cleaning is required, use the following solutions for less than 1 minute, at less than 40C. * Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. * Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PG1111C-0301 ~ 0 60 to 120 sec. 5 sec. max Stanley Electric Sales of America, Inc. 2660 Barranca Parkway, Irvine, CA 92606 * Tel: 800-LED-LCD1 (533-5231) * Fax: 949-222-0555 Website: www.stanley-electric.com |
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